oday, the 25th China Hi-Tech Fair (CHTF) officially opened in Shenzhen, bringing an international, professional high-tech event to the forefront. This year’s CHTF is hosted in two locations: the Shenzhen Convention and Exhibition Center (Futian) and the Shenzhen World Exhibition & Convention Center (Bao’an). The event features a comprehensive exhibition, specialized exhibitions, conferences, forums, and various other activities. According to the organizers, the event has attracted participation from over 100 countries and regions, with more than 4,000 companies exhibiting across a total area of 500,000 square meters, making it the largest in the fair’s history, with a record number of participating countries and regions.
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At the invitation of the Bao’an District Science and Technology Innovation Bureau, Chun Jun New Materials (Shenzhen) Co., Ltd., representing Bao’an District’s specialized and innovative enterprises, is participating in the exhibition. From November 15th to 19th, Chun Jun New Materials is showcasing its cutting-edge research achievements at Booth 1D38 in Hall 1 of the Shenzhen Convention and Exhibition Center (Futian).
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(Second from right: Bao’an District Mayor Wang Lide; First from left: Director of Bao’an District Science and Technology Innovation Bureau Shen Yan; First from right: Director of Bao’an District Science and Technology Innovation Service Center Wang Heng, visiting the Chun Jun booth for guidance)
At this year’s CHTF, Chun Jun New Materials is exhibiting its temperature control products and solutions in the cold chain, liquid cooling, and TEC fields. The exhibition attracted numerous leaders and industry peers from home and abroad, who engaged in discussions on the development of temperature control technology and its innovative applications across various fields.
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In the field of liquid cooling, Chun Jun presented its immersive liquid cooling solution under its “Chun Jun Opti-Cool” brand. In recent years, the demand for computing power has surged, with single cabinet power increasing rapidly. At the same time, the national standards for data center PUE (Power Usage Effectiveness) have become increasingly stringent, posing significant challenges for data centers. The “Chun Jun Opti-Cool” immersion liquid cooling solution addresses these industry challenges by reducing the PUE value to as low as 1.1 while ensuring excellent computing capacity through efficient temperature control. Notably, Chun Jun’s self-developed CJF1 coolant offers high heat dissipation performance and a significant price advantage, reducing coolant costs for customers by 40%.
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Chun Jun’s Micro-TEC technology, unlike ordinary TECs, can be miniaturized to millimeter-level sizes, with extremely demanding material performance and process requirements. On the materials side, Chun Jun’s self-developed N-type and P-type bismuth telluride rank among the industry’s best. On the product side, Chun Jun’s Micro-TEC achieves breakthroughs in miniaturization while delivering high cooling efficiency and precise temperature control. The superior performance of Chun Jun’s Micro-TEC holds great potential for replacing imports in fields such as optical modules and LiDAR.
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Innovation is the primary driving force for development. With the theme “Stimulating Innovation Vitality, Enhancing Development Quality,” this year’s CHTF brings together high-quality innovation resources. It serves as a dynamic platform for the in-depth implementation of the innovation-driven development strategy, the comprehensive fulfillment of high-quality development tasks, and the continuous improvement of the innovation ecosystem. The event embodies the belief that “focusing on innovation is focusing on development, and pursuing innovation is pursuing the future.”
Chun Jun New Materials warmly welcomes industry peers to visit our exhibition booth, where we aim to demonstrate technological advancements, create value connections, and strengthen confidence in China’s material technologies.
We wish the 25th China Hi-Tech Fair great success!
Post time: Aug-24-2024